Multi BMI Kits

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SPOX BMI™ connectors offer self-aligning features in one of the smallest blind-mate packages available. The unique low-profile design of the SPOX BMI™ allows for a mated stack distance of only 11.00mm (0.430"). Utilizing proven SPOX style contacts for high reliability, the products are suitable for situations requiring highly reliable tin interfaces. The Molex EBBI™ 50D series meets the market demand for low-cost, unshielded, high density, leaf-style connectors. Leaf-style terminals are arranged in two rows on .050" spacing within a polarized D-shaped housing for rugged mechanical protection. Housings are made of high-temperature, UL 94V-0 thermoplastic. Terminals are plated with 30 micro-inches min. gold in the mating area for long term reliability and durability. The Mini-Fit™ BMI is designed for high current/ high density applications requiring the blind mating of modules, subassemblies or printed circuit boards. The Mini-Fit™ BMI allows a misalignment of up to .100". It is appropriate for both power and signal applications as it can carry currents of up to 9.0A per circuit and has a 10mW contact resistance. Micro-Fit 3.0™ BMI 3.00mm (.118") pitch connectors are the perfect choice when you need compact connectors that carry up to 5 amperes of current.

1 Kit Found.
Part Number
CategorySolutionConnector FamilyDescriptionMSRPCompare
76650-0146Board-to-Board, Wire-to-Board, Wire-to-WireBlind-MateEBBI™ 50D, Micro-Fit 3.0™, Mini-Fit BMI™, Multi BMI, SPOX BMI™, Micro-Fit 3.0 BMI™

Deluxe Blind-Mate Solution Kit